Electronic element

ABSTRACT

An wiring board is provided so as to wrap a semiconductor chip, and on the outer surface of wiring board, a plurality of external terminals are provided three-dimensionally, i.e., on the upper, lateral and bottom sides. External terminals are connected to an electrode area of the wiring pattern provided to wiring board for electrically connecting to an external element. According to this configuration, a structure of an electronic element enabling free arrangement of an electronic device addressing various designs of the final products, and an electronic device using the electronic element can be provided.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to an electronic element, and morespecifically, to an electronic element having a structure enabling athree dimensional packaging.

[0003] 2. Description of the Background Art

[0004] As shown in FIG. 45, external terminals 201 of a conventionalelectronic element (such as a semiconductor element) 200 are oftenarranged in a line along the sides of electronic element 200 to besuitable for an arrangement on a planer (two-dimensional) substrate suchas a print circuit board 210. As a variation of the external terminals,substantially spherical electrodes referred to as bump electrodes may beprovided on the same plane facing to the print circuit board of anelectronic part.

[0005] Additionally, as shown in FIG. 45, in an electronic device (suchas a semiconductor device mounted with semiconductor elementscompositively) 300, when packaging electronic element 200 to printcircuit board 210, electronic element 200 is arranged on a surface ofprint circuit board 210 two dimensionally, and connected to otherelectronic device via external connection terminals 220 provided atperiphery of print circuit board 210.

[0006] As for the electronic device employing the electronic elementabove, often a plate-like substrate that only utilizes the spacetwo-dimensionally is used, which requires efforts for designing inefficient placement of the plate-like substrate, conforming to variousconstraints related to the design of final products. Further, in somecases, modification of the design of the final products is required.

SUMMARY OF THE INVENTION

[0007] The object of the present invention is to solve the problemsabove, and to provide the structure of an electronic element enablingfree arrangement of an electronic device addressing various designs ofthe final products, and an electronic device using the electronicelement.

[0008] An electronic element according to the present invention to solvethe problems above includes: an electronic part; a wiring board formedwith a flexible material and arranged to surround the electronic partwith a prescribed wiring pattern provided to an outer surface thereoffor electrically connecting to an electrode area of the electronic part;and a plurality of external terminals arranged to an outer surface ofthe wiring board three-dimensionally and connected to an electrode areaof the wiring pattern for electrically connecting to outside. As theelectronic part above, an active element such as a semiconductor chip,and a passive element such as a capacitor and a resistor are included.

[0009] According to this configuration, since external terminals areprovided to the outer surface of wiring board three-dimensionally, notonly conventional two-dimensional arrangement but also three-dimensionalarrangement can be implemented in the layout of an electric element. Asa result, when designing an electronic device formed with a plurality ofelectronic elements, the shape of the electronic device may bedetermined more freely as compared to the conventional shape, and thusfreedom in designing the electronic element can largely be improved.

[0010] According to an electronic device, the device is configured byconnecting respective selected external terminals of the electronicelements above. By employing this configuration, since the electronicelements are arranged three-dimensionally, when designing an electronicdevice formed with a plurality of electronic elements, the shape of theelectronic device may be determined more freely as compared to theconventional shape, and thus freedom in designing the electronic elementcan largely be improved. Additionally, the number of signals maydrastically be increased.

[0011] The foregoing and other objects, features, aspects and advantagesof the present invention will become more apparent from the followingdetailed description of the present invention when taken in conjunctionwith the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012]FIG. 1 is an overall perspective view showing the structure of asemiconductor element according to a first embodiment;

[0013]FIG. 2 is a perspective view showing only the internal structureof the semiconductor element according to the first embodiment;

[0014]FIG. 3 is a cross sectional view along a line III-III in FIG. 1;

[0015]FIG. 4 is a cross sectional view along a line IV-IV in FIG. 1;

[0016]FIG. 5 is an overall perspective view showing the structure of thesemiconductor device, in another external shape, according to the firstembodiment;

[0017]FIG. 6 is a perspective view showing only the internal structureof the semiconductor element shown in FIG. 5;

[0018]FIG. 7 is an overall perspective view showing the structure of thesemiconductor device, in another external shape, according to the firstembodiment;

[0019]FIG. 8 is a perspective view showing only the internal structureof the semiconductor element shown in FIG. 7;

[0020]FIG. 9 is an overall perspective view showing the structure of thesemiconductor device, in another external shape, according to the firstembodiment;

[0021]FIG. 10 is a perspective view showing only the internal structureof the semiconductor element shown in FIG. 9;

[0022]FIG. 11 is an overall perspective view showing the structure of asemiconductor element according to a second embodiment;

[0023]FIG. 12 is a perspective view showing only the internal structureof the semiconductor element according to the second embodiment;

[0024]FIG. 13 is a cross sectional view along a line XIII-XIII in FIG.11;

[0025]FIG. 14 is a cross sectional view along a line XIV-XIV in FIG. 11;

[0026]FIG. 15 is an overall perspective view showing the structure ofthe semiconductor device, in another external shape, according to thesecond embodiment;

[0027]FIG. 16 is a perspective view showing only the internal structureof the semiconductor element shown in FIG. 15;

[0028]FIG. 17 is an overall perspective view showing the structure ofthe semiconductor device, in another external shape, according to thesecond embodiment;

[0029]FIG. 18 is a perspective view showing only the internal structureof the semiconductor element shown in FIG. 17;

[0030]FIG. 19 is an overall perspective view showing the structure ofthe semiconductor device, in another external shape, according to thesecond embodiment;

[0031]FIG. 20 is a perspective view showing only the internal structureof the semiconductor element shown in FIG. 19;

[0032] FIGS. 21 to 25 are cross sectional views showing the structure ofsemiconductor elements according to third to seventh embodiments;

[0033]FIG. 26 is a cross sectional view showing the structure of anelectronic element according to an eighth embodiment;

[0034]FIG. 27 is a cross sectional view showing the overall structure ofa semiconductor element according to a ninth embodiment;

[0035]FIG. 28 is a cross sectional view showing the overall structure ofa semiconductor element according to a tenth embodiment;

[0036]FIG. 29 is a cross sectional view showing the overall structure ofa semiconductor element according to an eleventh embodiment;

[0037]FIG. 30 is a perspective view showing the overall structure of asemiconductor element according to the eleventh embodiment;

[0038] FIGS. 31 to 37 are illustrations related to first to seventhsteps showing a manufacturing method of a semiconductor elementaccording to a twelfth embodiment;

[0039] FIGS. 38 to 44 are illustrations related to first to seventhsteps showing a manufacturing method of other semiconductor elementaccording to a thirteenth embodiment; and

[0040]FIG. 45 is an overall perspective view showing the structure of aconventional electronic element (such as a semiconductor device).

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0041] In the following, referring to the figures, the structure of anelectronic element and an electronic device using the electronic elementaccording to the present invention will be described.

[0042] (First Embodiment)

[0043] Referring to FIGS. 1 to 4, the structure of a semiconductorelement 111 that is one example of an electronic element according tothe present embodiment will be described.

[0044] (Structure of Semiconductor Element 111)

[0045] Referring to FIGS. 1 to 4, semiconductor element 111 includes asemiconductor chip 1 as an electronic part therein. On the upper surfaceof semiconductor chip 1, along opposing sides in the longitudinaldirection, a plurality of electrode areas 3 are provided.

[0046] A wiring board 2 of a flexible material is provided so as tosurround semiconductor chip 1. A possible material for wiring board 2includes polyimide, glass epoxy and the like.

[0047] An abutment portion 2A of opposing ends of wiring board 2 isarranged at the same side where each electrode area 3 of semiconductorchip 1 is provided, so that wiring board 2 wraps semiconductor chip 1.

[0048] A predetermined wiring pattern (not shown) is provided on anouter surface of wiring board 2. An electrode area 2B provided on theouter surface of wiring board 2 and electrode area 3 provided onsemiconductor chip 1 are electrically connected by wire 4. Wiring board2 is adhesively fixed to semiconductor chip 1 via adhesive layers 5 and6.

[0049] A sealing resin 7 for sealing is formed so as to cover electrodeareas 2B, 3 and wire 4 as well as to fill a space between semiconductorchip 1 and wiring board 2. Sealing resin 7 prevents short circuitbetween electrode areas 2B, 3 and wire 4, and other external electricalterminal, and further, prevents failure of the connection area betweenelectrode areas 2B, 3 and wire 4. Therefore, reliability ofsemiconductor element 111 is improved.

[0050] On the outer surface of wiring board 2, a plurality of externalterminals 8 are provided three-dimensionally, i.e., on the upper,lateral and bottom sides, each of which is to be connected to anelectrode area of the wiring pattern for electrically connecting to anexternal element. External terminals 8 are formed with a metal materialor the like, and substantially spherical in shape.

[0051] (Variation)

[0052] As semiconductor elements having the structure similar tosemiconductor element 111 described above, and having different exteriorshape, a semiconductor element 112 shown in FIGS. 5 and 6, asemiconductor element 113 shown in FIGS. 7 and 8, and a semiconductorelement 114 shown in FIGS. 9 and 10 can be found.

[0053]FIGS. 5, 7 and 9 are overall perspective views showing structuresof semiconductor elements 112, 113 and 114, and FIGS. 6, 8 and 10 areperspective views showing only inner structures of semiconductorelements 112, 113 and 114. An identical reference character is given toan identical or similar part to that of semiconductor element 111, andsimilar description thereof will not be repeated.

[0054] Semiconductor element 112 shown in FIGS. 5 and 6 is structured asfollows. Electrode areas 3 are provided so as to cross the middle ofsemiconductor chip 1. External terminals 8 are provided at upper,lateral and bottom sides shown in FIG. 3 (external terminal 8 is notprovided to the lateral side shown in FIG. 4).

[0055] Semiconductor element 113 shown in FIGS. 7 and 8 is structured asfollows. Electrode areas 3 are provided along diagonal line ofsemiconductor chip 1. Wiring board 2 is folded back conforming to fourperipheral sides of semiconductor chip 1. External terminals 8 areprovided to all sides of wiring board 2, namely, to upper, lateral andbottom sides.

[0056] Semiconductor element 114 shown in FIGS. 9 and 10 is structuredas follows. Electrode areas 3 are provided along four peripheral sidesof semiconductor chip 1. Openings 2C are provided to wiring board 2 atfour portions along four peripheral sides of semiconductor chip 1 forpassing wires 4. Wiring board 2 is folded back conforming to fourperipheral sides of semiconductor chip 1. External terminals 8 areprovided to all sides of wiring board 2, namely, to upper, lateral andbottom sides.

[0057] As in the foregoing, according to semiconductor elements 111,112, 113, and 114 with the structures described above, since externalterminals 8 are provided to the outer surface of wiring board 2three-dimensionally, not only conventional two-dimensional arrangementbut also three-dimensional arrangement can be implemented in the layoutof an electric element. As a result, when designing an electronic deviceformed with a plurality of semiconductor elements, the shape of theelectronic device may be determined more freely as compared to theconventional shape, and thus freedom in designing electronic element canlargely be improved.

[0058] As for the positions of external terminals 8, three-dimensionalarrangement of external terminals 8 is attained as long as they areprovided on three sides including upper, bottom, and any selectivelateral sides, and thus the operation and effect above may be attained.Therefore, external terminals 8 are not necessarily be provided to allof the sides. It is also true for the following embodiments.

[0059] (Second Embodiment)

[0060] Referring to FIGS. 11 to 14, the structure of semiconductorelement 121 of one example of an electronic element according to thepresent embodiment will be described. An identical reference characteris given to an identical or similar part to that of semiconductorelement 111, and similar description thereof will not be repeated.

[0061] (Structure of Semiconductor Element 121)

[0062] Referring to FIGS. 11 to 14, semiconductor element 121 isdifferent from semiconductor element 111 of the first embodiment in thatabutment portion 2A of opposing ends of wiring board 2 is provided tothe opposite side to the side where electrode areas 3 of semiconductorchip 1 are provided. The rest of the configuration is the same assemiconductor element 111 of the first embodiment.

[0063] (Variation)

[0064] As semiconductor devices having similar structure tosemiconductor element 121 and having different exterior shape, asemiconductor element 122 shown in FIGS. 15 and 16, a semiconductorelement 123 shown in FIGS. 17 and 18, a semiconductor element 124 shownin FIGS. 19 and 20 can be found.

[0065]FIGS. 15, 17 and 19 are overall perspective views showingstructures of semiconductor elements 122, 123 and 124, and FIGS. 16, 18and 20 are perspective views showing only inner structures ofsemiconductor elements 122, 123 and 124. An identical referencecharacter is given to an identical or similar part to that ofsemiconductor element 121, and similar description thereof will not berepeated.

[0066] Semiconductor element 122 shown in FIGS. 15 and 16 is structuredas follows. Electrode areas 3 are provided so as to cross the middle ofsemiconductor chip 1. An opening 2D for passing wire 4 is provided towiring board 2 at the position opposing to the middle portion ofsemiconductor chip 1. The rest of the configuration is the same withthat of semiconductor element 112 shown in FIG. 5, only that abutmentportion 2A of opposing ends of wiring board 2 is arranged to theopposite side to the side where electrode areas 3 of semiconductor chip1 are provided.

[0067] Semiconductor element 123 shown in FIGS. 17 and 18 andsemiconductor element 124 shown in FIGS. 19 and 20 has the samestructure with that of semiconductor element 113 shown in FIG. 7 andsemiconductor element 114 shown in FIG. 9, only that abutment portion 2Aof opposing ends of wiring board 2 is arranged to the opposite side tothe side where electrode areas 3 of semiconductor chip 1 are provided.

[0068] As in the foregoing, according to semiconductor elements 121,122, 123, and 124 with the structure above, since external terminals 8are provided to the outer surface of wiring board 2 three-dimensionally,not only conventional two-dimensional arrangement but alsothree-dimensional arrangement can be implemented in the layout of anelectric element. As a result, when designing an electronic deviceformed with a plurality of semiconductor elements, the shape of theelectronic device may be determined more freely as compared to theconventional shape, and thus freedom in designing electronic element canlargely be improved.

[0069] (Third to Seventh Embodiments)

[0070] Referring to FIGS. 21 to 25, other variations of semiconductorelement 124 with the structure shown in FIG. 19 of the second embodimentabove will be described. Cross sectional structures respectively shownare applicable to the structure shown in FIGS. 9 and 19, as well as tothe semiconductor elements 111, 112, 113, and 114 of the firstembodiment, and to the semiconductor elements 121, 122, 123, and 124 ofthe second embodiment.

[0071] (Third Embodiment)

[0072] Referring to FIG. 21, the structure of a semiconductor element131 according to the present embodiment will be described. Thestructural characteristics of semiconductor element 131 is that itemploys an arrangement in which wiring protrusions 9 directly providedon the outer surface of wiring board 2 are used in place of wires 4 usedin each embodiment above, to be connected to electrode areas 3 providedon a semiconductor chip 1. According to this configuration, similaroperation and effect to the embodiments above can also be attained.

[0073] (Fourth Embodiment)

[0074] Referring to FIG. 22, the structure of a semiconductor element141 according to the present embodiment will be described. Thestructural characteristics of semiconductor element 141 is onlydifferent from that of semiconductor element 131 above in that abutmentportion 2A of opposing ends of wiring board 2 is arranged to theopposite side to the side where electrode areas 3 of semiconductor chip1 are provided. The rest of the configuration is the same with that ofsemiconductor element 131 according to the third embodiment. Accordingto this configuration, similar operation and effect to the embodimentsabove can also be attained.

[0075] (Fifth Embodiment)

[0076] Referring to FIG. 23, the structure of a semiconductor element151 according to the present embodiment will be described. Thestructural characteristics of semiconductor element 151 is that, ascompared to semiconductor element 131 above, electrode area 2B of wiringboard 2 is provided at the inner surface of wiring board 2, andelectrode area 2B and electrode area 3 provided on semiconductor chip 1are connected with conductive bump 10. According to this configuration,similar operation and effect to the embodiments above can also beattained.

[0077] (Sixth Embodiment)

[0078] Referring to FIG. 24, the structure of a semiconductor element161 according to the present embodiment will be described. Thestructural characteristics of semiconductor element 161 is onlydifferent from that of semiconductor element 151 above in that abutmentportion 2A of opposing ends of wiring board 2 is arranged to theopposite side to the side where electrode areas 3 of semiconductor chip1 are provided. The rest of the configuration is the same with that ofsemiconductor element 151 according to the fifth embodiment. Accordingto this configuration, similar operation and effect to the embodimentsabove can also be attained.

[0079] (Seventh Embodiment)

[0080] Referring to FIG. 25, the structure of a semiconductor element171 according to the present embodiment will be described. Thestructural characteristics of semiconductor element 171 is differentfrom the structures of embodiments described above in that aninterconnection layer 2E is further provided to the outer surface ofwiring board 2 for increasing the total number of interconnections.According to this configuration, similar operation and effect to theembodiment above can also be attained. It should be noted that the sameoperation and effect can be attained where abutment portion 2A ofopposing ends of wiring board 2 is arranged to the opposite side to theside where electrode areas 3 of semiconductor chip 1 are provided.

[0081] (Eighth Embodiment)

[0082] The first to seventh embodiments are all related to thesemiconductor element using semiconductor chip 1 as an active element,while the present embodiment is related to an electronic element 181 inwhich, as shown in a cross sectional view of FIG. 26, a passive element11, 12 such as illustrated condenser, resistor or the like is coveredwith wiring board 2. The rest of the configuration is the same with thefirst to seventh embodiments, only that each semiconductor chip 1thereof is replaced by passive element 11, 12.

[0083] According to this configuration also, since external terminals 8are provided to the outer surface of wiring board 2 three-dimensionally,not only conventional two-dimensional arrangement but alsothree-dimensional arrangement can be implemented in the layout of apassive element. As a result, when designing an electronic device formedwith a plurality of passive elements, the shape of the electronic devicemay be determined more freely as compared to the conventional shape, andthus freedom in designing electronic element can largely be improved.

[0084] (Ninth to Eleventh Embodiments)

[0085] The first to eighth embodiments are all related to the structureof the electronic elements, while the present ninth to tenth embodimentsare related to the structure of a device using the electronic elementsdescribed in the first to eighth embodiments. In the following, though acase in which semiconductor element 171 of the seventh embodiment isused will be described, it is not limited to semiconductor element 171,and semiconductor elements 111, 112, 113, 114, 121, 122, 123, 124, 131,141, 151, and 161, and electronic element 181 can also be employed.

[0086] (Ninth Embodiment)

[0087] Referring to FIG. 27, the structure of electronic device 201 inthe present embodiment will be described. Electronic device 201 isstructured three-dimensionally, by directly connecting externalterminals 8 to each other, which are selected from external terminals 8provided on semiconductor element 171.

[0088] According to this configuration, since semiconductor elements 171are arranged three-dimensionally, when designing electronic device 201formed with a plurality of semiconductor elements 171, the shape ofelectronic device 201 may be determined more freely as compared to theconventional shape, and thus freedom in designing electronic device 201can largely be improved. Additionally, the number of signals maydrastically be increased.

[0089] (Tenth Embodiment)

[0090] Referring to FIG. 28, the structure of electronic device 202 inthe present embodiment will be described. Semiconductor device 202 ischaracterized in that, as compared to the structure of electronic device201, it has a conductive member intervened between external terminals 8connected to each other. As the conductive member, a conductive part 21,a passive element 22 or the like can be used. Thus, according to thepresent configuration also, the same operation and effect similar to theninth embodiment can be attained.

[0091] (Eleventh Embodiment)

[0092] Referring to FIGS. 29 and 30, the structure of electronicapparatus 203 in the present embodiment will be described. An electronicapparatus 203 is configured as follows: a plurality of semiconductorelements 171 are provided in a cylindrical substrate 30 having aplurality of external electrodes 31 and a plurality of internalelectrodes 32 at prescribed positions, and selectively connectingexternal terminals 8 on semiconductor elements 171 to each other. Thoughin the present embodiment semiconductor elements 171 are arranged inhelical fashion, it is not limited to the helical fashion and anythree-dimensional structure of arbitrary layered structure may beemployed. As shown in FIG. 30, cylindrical substrate 30 is filled insidewith resin 33 in order to attain resin sealing. According to the presentconfiguration also, the same operation and effect similar to the ninthembodiment can be attained.

[0093] (Twelfth Embodiment)

[0094] Next, referring to FIGS. 31 to 37, a method for manufacturing thesemiconductor element above will be described, using semiconductorelement 113 according to the first embodiment shown in FIG. 7 as anexample. First, as shown in FIG. 31, a band-like wiring board 2F isprepared, and prescribed shape of openings 2H are punched at fourposition, to form folding areas 2 b, 2 c, 2 d, and 2 e in substantiallytriangle shape, extending radially from four peripheral sides of bottomarea 2 a in substantially quadrangle shape. In order to improve workingefficiency, bottom area 2 a is connected to band-like wiring board 2F byframes 2K. Then, to the prescribed positions on the outer surface ofconnection portion between bottom area 2 a and folding areas 2 b, 2 c, 2d, and 2 e, external terminals 8 are attached in advance.

[0095] Next, referring to FIG. 32, semiconductor chip 1 is fixed tobottom area 2 a by an adhesive tape (adhesive layer) 5. To each offolding areas 2 b, 2 c, 2 d, and 2 e also, an adhesive tape (adhesivelayer) 6 is applied in advance. Thereafter, referring to FIG. 33,folding areas 2 b, 2 c, 2 d, and 2 e are folded so as to wrapsemiconductor chip 1, and fixed to front side of semiconductor chip 1.

[0096] Next, referring to FIG. 34, electrode area 2B provided on theouter surface of wiring board 2 and electrode area 3 provided onsemiconductor chip 1 is connected by wire 4 (wire bonding). Thereafter,referring to FIGS. 35 and 36, resin 7 is injected by a resin injectingdevice 70 so as to cover the connection area of wire 4 between electrodeareas 2B and 3 as well as to bury the space between semiconductor chip 1and wiring board 2 (resin sealing).

[0097] Next, referring to FIG. 37, a plurality of external terminals 8are attached to prescribed positions at the outer surface of bottom area2 a and folding areas 2 b, 2 c, 2 d, and 2 e. Thereafter, by cuttingframes 2K of band-like wiring board 2F, semiconductor element 113 iscompleted.

[0098] As described above, by forming semiconductor element 113utilizing band-like wiring board 2F, wiring board 2 can be arranged tosurround semiconductor chip 1 and external terminals 8 can be attachedto the outer surface of wiring board 2. Additionally, since it isapplicable to a mass production line, productivity can also be improved.

[0099] (Thirteenth Embodiment)

[0100] Next, referring to FIGS. 38 to 44, a method for manufacturing thesemiconductor element above will be described, using semiconductorelement 114 shown in FIG. 9 as an example. First, as shown in FIG. 38, aband-like wiring board 2F is prepared, and prescribed shape of openings2H are punched at four position, to form folding areas 2 b, 2 c, 2 d,and 2 e, extending radially from four peripheral sides of bottom area 2a in substantially quadrangle shape. For each of folding areas 2 b, 2 c,2 d, and 2 e, an opening 2C is provided. In order to improve workingefficiency, bottom area 2 a is connected to band-like wiring board 2F byframes 2K. Then, to the prescribed positions on the outer surface ofconnection portion between bottom area 2 a and folding areas 2 b, 2 c, 2d, and 2 e, external terminals 8 are attached in advance.

[0101] Next, referring to FIG. 39, semiconductor chip 1 is fixed tobottom area 2 a by an adhesive tape (adhesive layer) 5. To each offolding areas 2 b, 2 c, 2 d, and 2 e also, an adhesive tape (adhesivelayer) 6 is applied in advance. Opening 2C should not be covered byadhesive tape (adhesive layer) 6. Thereafter, referring to FIG. 40,folding areas 2 b, 2 c, 2 d, and 2 e are folded so as to wrapsemiconductor chip 1, and fixed to front side of semiconductor chip 1.

[0102] Next, referring to FIG. 41, wire 4 is arranged so as to passthrough opening 2C, and electrode area 2B provided on the outer surfaceof wiring board 2 and electrode area 3 provided on semiconductor chip 1is connected by wire 4 (wire bonding). Thereafter, referring to FIGS. 42and 43, resin 7 is injected by a resin injecting device 70 so as tocover opening 2C exposing the connection area of wire 4 betweenelectrode areas 2B and 3 as well as to bury the space betweensemiconductor chip 1 and wiring board 2 (resin sealing).

[0103] Next, referring to FIG. 44, a plurality of external terminals 8are attached to prescribed positions at the outer surface of bottom area2 a and folding areas 2 b, 2 c, 2 d, and 2 e. Thereafter, by cuttingframes 2K of band-like wiring board 2F, semiconductor element 114 iscompleted.

[0104] As described above, by forming semiconductor element 114utilizing band-like wiring board 2F, wiring board 2 can be arranged tosurround semiconductor chip 1 and external terminals 8 can be attachedto the outer surface of wiring board 2. Additionally, since it isapplicable to a mass production line, productivity can also be improved.

[0105] Though the twelfth and thirteenth embodiments above are relatedto manufacturing methods for semiconductor elements 113 and 114according to the first embodiment, the semiconductor elements accordingto the second to seventh embodiments and the electronic elementaccording to the eighth embodiment can also be manufactured by applyingsimilar manufacturing method.

[0106] In order to implement the electronic elements above in furtherpreferable state, modes described below may be employed.

[0107] For example, the electronic element preferably includesconnecting means for connecting an electrode area provided to theelectronic part and a prescribed electrode area of the wiring board, andan adhesive layer provided between the electronic part and the wiringboard, and at least the electrode area and the connecting means aresealed with resin. Thus, the resin sealing of the electrode area and theconnecting means prevents short circuit to other external electricalterminals, and further, prevents failure of the connection area betweenthe electrode area and the connecting means. Therefore, reliability ofthe electronic part is improved.

[0108] Further, preferably in the electronic element, the prescribedelectrode area of the wiring board is provided on the outer or the innersurface of the wiring board.

[0109] Still further, preferably in the electronic element, an abutmentportion of opposing ends of the wiring board is provided to the sidewhere the electrode area of the electronic part is provided, so as towrap the electronic part.

[0110] Still further, preferably in the electronic element, an abutmentportion of opposing ends of the wiring board is provided to an oppositeside to the side where the electrode area of the electronic part isprovided, so as to wrap the electronic part.

[0111] Still further, preferably in the electronic element, aninterconnection layer is provided to intervene the wiring board and theexternal terminals.

[0112] Still further, preferably in the electronic element, a prescribedelectrode area is provided to the inner surface of the wiring board, theelectrode area provided to the electronic part and the prescribedelectrode area of the wiring board are directly connected, and theelectronic part is sealed with resin in the wiring board.

[0113] Still further, preferably in the electronic device, therespective selected external terminals are directly connected to eachother.

[0114] Still further, preferably in the electronic device, therespective selected external terminals are connected to each other via aconductive member.

[0115] Still further, preferably the electronic apparatus has astructure in which the electronic device is packaged in a cylindricalsubstrate having an external and internal electrodes corresponding tothe outer and inner surface thereof, respectively, and the electronicdevice is sealed with resin in the cylindrical substrate with theexternal terminal connected to the prescribed inner electrode.

[0116] According to the electronic element and the electronic deviceaccording to the present invention, since the external terminals areprovided to the outer surface of the wiring board three-dimensionally,not only conventional two-dimensional arrangement but alsothree-dimensional arrangement can be implemented in the layout of anelectric element. As a result, when designing an electronic deviceformed with a plurality of semiconductor elements, the shape of theelectronic device may be determined more freely as compared to theconventional shape, and thus freedom in designing electronic element canlargely be improved.

[0117] Although the present invention has been described and illustratedin detail, it is clearly understood that the same is by way ofillustration and example only and is not to be taken by way oflimitation, the spirit and scope of the present invention being limitedonly by the terms of the appended claims.

What is claimed is:
 1. An electronic element, comprising: an electronicpart; a wiring board formed with a flexible material and arranged tosurround said electronic part with a prescribed wiring pattern providedto an outer surface thereof for electrically connecting to an electrodearea of said electronic part; and a plurality of external terminalsarranged to an outer surface of said wiring board three-dimensionallyand connected to an electrode area of said wiring pattern forelectrically connecting to outside.
 2. The electronic element accordingto claim 1, further comprising: connecting means for connecting theelectrode area provided to said electronic part and a prescribedelectrode area of said wiring board; and an adhesive layer providedbetween said electronic part and said wiring board; wherein at leastsaid electrode area and said connecting means are sealed with resin. 3.The electronic element according to claim 2, wherein said prescribedelectrode area of said wiring board is provided on an outer surface ofsaid wiring board.
 4. The electronic element according to claim 2,wherein said prescribed electrode area of said wiring board is providedon an inner surface of said wiring board.
 5. The electronic elementaccording to claim 1, wherein an abutment portion of opposing ends ofsaid wiring board is provided to a side where said electrode area ofsaid electronic part is provided, so as to wrap said electronic part. 6.The electronic element according to claim 1, wherein an abutment portionof opposing ends of said wiring board is provided to an opposite side toa side where said electrode area of said electronic part is provided, soas to wrap said electronic part.
 7. The electronic element according toclaim 1, wherein an interconnection layer is provided to intervenebetween said wiring board and said external terminals.
 8. The electronicelement according to claim 1, wherein a prescribed electrode area isprovided to an inner surface of said wiring board, an electrode areaprovided to said electronic part and a prescribed electrode area of saidwiring board are directly connected, and said electronic part is sealedwith resin in said wiring board.